Publication:

Cu interconnect lifetime estimation in the presence of thermal gradients

Date

2025
Journal article
https://doi.org/10.1063/5.0245489
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dc.contributor.authorDing, Youqi
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLofrano, Melina
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCiofi, Ivan
dc.contributor.authorChavez, T.
dc.contributor.authorFarr, H.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDing, Y.
dc.contributor.imecauthorPedreira, O. Varela
dc.contributor.imecauthorLofrano, M.
dc.contributor.imecauthorZahedmanesh, H.
dc.contributor.imecauthorCiofi, I.
dc.contributor.imecauthorChavez, T.
dc.contributor.imecauthorDe Wolf, I.
dc.contributor.imecauthorCroes, K.
dc.date.accessioned2025-03-04T19:59:26Z
dc.date.available2025-03-04T19:59:26Z
dc.date.issued2025
dc.identifier.doi10.1063/5.0245489
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45286
dc.publisherAIP Publishing
dc.source.beginpage075106
dc.source.issue7
dc.source.journalJOURNAL OF APPLIED PHYSICS
dc.source.numberofpages14
dc.source.volume137
dc.subject.keywordsSTRESS EVOLUTION
dc.subject.keywordsELECTRIC-CURRENT
dc.subject.keywordsELECTROMIGRATION
dc.subject.keywordsTHERMOMIGRATION
dc.subject.keywordsRELIABILITY
dc.subject.keywordsTEMPERATURE
dc.title

Cu interconnect lifetime estimation in the presence of thermal gradients

dc.typeJournal article
dspace.entity.typePublication
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