Cu interconnect lifetime estimation in the presence of thermal gradients

dc.contributor.author	Ding, Y.
dc.contributor.author	Pedreira, O. Varela
dc.contributor.author	Lofrano, M.
dc.contributor.author	Zahedmanesh, H.
dc.contributor.author	Ciofi, I.
dc.contributor.author	Chavez, T.
dc.contributor.author	Farr, H.
dc.contributor.author	De Wolf, I.
dc.contributor.author	Croes, K.
dc.contributor.imecauthor	Ding, Y.
dc.contributor.imecauthor	Pedreira, O. Varela
dc.contributor.imecauthor	Lofrano, M.
dc.contributor.imecauthor	Zahedmanesh, H.
dc.contributor.imecauthor	Ciofi, I.
dc.contributor.imecauthor	Chavez, T.
dc.contributor.imecauthor	De Wolf, I.
dc.contributor.imecauthor	Croes, K.
dc.date.accessioned	2025-03-04T19:59:26Z
dc.date.available	2025-03-04T19:59:26Z
dc.date.issued	2025-FEB 21
dc.identifier.doi	10.1063/5.0245489
dc.identifier.issn	0021-8979
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/45286
dc.publisher	AIP Publishing
dc.source.issue	7
dc.source.journal	JOURNAL OF APPLIED PHYSICS
dc.source.numberofpages	14
dc.source.volume	137
dc.subject.keywords	STRESS EVOLUTION
dc.subject.keywords	ELECTRIC-CURRENT
dc.subject.keywords	ELECTROMIGRATION
dc.subject.keywords	THERMOMIGRATION
dc.subject.keywords	RELIABILITY
dc.subject.keywords	TEMPERATURE
dc.title	Cu interconnect lifetime estimation in the presence of thermal gradients
dc.type	Journal article
dspace.entity.type	Publication
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