Publication:

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

Date

2023

Proceedings Paper

https://doi.org/10.1109/irps48203.2023.10117870

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Author(s)

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Varela Pedreira, Olalla

;

Lofrano, Melina

;

Zahedmanesh, Houman

;

;

;

De Wolf, Ingrid

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Journal

N/A

Statistics

765 since deposited on 2023-07-15

Acq. date: 2026-09-19