Publication:

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

Date

2023
Proceedings Paper
https://doi.org/10.1109/IRPS48203.2023.10117870
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dc.contributor.authorDing, Youqi
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLofrano, Melina
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorChavez, T.
dc.contributor.authorFarr, H.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDing, Youqi
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDing, Youqi::0000-0001-8873-572X
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecLofrano, Melina::0000-0002-3930-6459
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2024-05-07T08:37:09Z
dc.date.available2023-07-15T17:05:47Z
dc.date.available2024-05-07T08:37:09Z
dc.date.issued2023
dc.description.wosFundingTextThe authors would like to thank the participants of reliability and thermal meetings as well as the members of the Nano-interconnect program for the fruitful discussions. Also, imec's industrial affiliation R&D program on Optical I/O is acknowledged for support on the thermal gradient test structure. Special thanks go to Emmanuel Chery for his assistance with measurement preparation and valuable insight on visualization. Myriam Van de Peer and Veerle Simons are acknowledged for their help with operational work and Chris Drijbooms, Manasi Gade and Filip Beirnaert for the FIB and SEM inspections.
dc.identifier.doi10.1109/IRPS48203.2023.10117870
dc.identifier.eisbn978-1-6654-5672-2
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42160
dc.publisherIEEE
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.journalN/A
dc.source.numberofpages7
dc.subject.keywordsTEMPERATURE
dc.subject.keywordsELECTROMIGRATION
dc.title

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

dc.typeProceedings paper
dspace.entity.typePublication
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