Browsing by Author "Chen, Pinhong"
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Publication Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Proceedings paper2023, IEEE International 3D Systems Integration Conference (3DIC), MAY 10-12, 2023Publication Iterative Layout-Aware Power, Thermal, and IR-Drop Co-Optimization: Ensuring Convergency in 3D-ICs
Journal article2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, (15) 4, p.648-658Publication Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC
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