Browsing by Author "Chen, Pinhong"
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Publication Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Proceedings paper2023, IEEE International 3D Systems Integration Conference (3DIC), MAY 10-12, 2023Publication Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC
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