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Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC
Publication:
Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC
Date
2024
Proceedings Paper
https://doi.org/10.1109/ISVLSI61997.2024.00018
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Naeim, Mohamed
;
Oprins, Herman
;
Das, Sudipta
;
Van der Plas, Geert
;
Dai, Yun
;
Chen, Pinhong
;
Kao, C. T.
;
Biswas, Dwaipayan
;
Milojevic, Dragomir
Journal
N/A
Abstract
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241
since deposited on 2025-01-10
Acq. date: 2025-10-26
Citations
Metrics
Views
241
since deposited on 2025-01-10
Acq. date: 2025-10-26
Citations