Publication:

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC

Date

2024
Proceedings Paper
https://doi.org/10.1109/ISVLSI61997.2024.00018
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dc.contributor.authorNaeim, Mohamed
dc.contributor.authorOprins, Herman
dc.contributor.authorDas, Sudipta
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDai, Yun
dc.contributor.authorChen, Pinhong
dc.contributor.authorKao, C. T.
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.authorMilojevic, Dragomir
dc.contributor.imecauthorNaeim, Mohamed
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDas, Sudipta
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBiswas, Dwaipayan
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDas, Sudipta::0009-0007-2998-9827
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBiswas, Dwaipayan::0000-0002-1087-3433
dc.date.accessioned2025-04-16T08:04:02Z
dc.date.available2025-01-10T17:08:38Z
dc.date.available2025-04-16T08:04:02Z
dc.date.issued2024
dc.identifier.doi10.1109/ISVLSI61997.2024.00018
dc.identifier.eisbn979-8-3503-5411-9
dc.identifier.issn2159-3469
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45058
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage33
dc.source.conferenceIEEE-Computer-Society Annual Symposium on VLSI (ISVLSI)
dc.source.conferencedateJUL 01-03, 2024
dc.source.conferencelocationKnoxville
dc.source.endpage38
dc.source.journalN/A
dc.source.numberofpages6
dc.subject.keywordsRESISTANCE
dc.title

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC

dc.typeProceedings paper
dspace.entity.typePublication
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