Browsing by Author "Coenen, Jens"
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Publication 3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
; ; ; ; Proceedings paper2009, IEEE 3D-IC, 28/09/2009Publication Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.1083-1087Publication Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
Meeting abstract2010, Materials for Advanced Metallization - MAM, 7/03/2010