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Browsing by Author "Croes, K."

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    Analytical bounds for the MLE of the Weibull shape parameter

    Andries, E.
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    Croes, K.
    ;
    De Ceuninck, Ward  
    ;
    De Schepper, Luc
    ;
    Molenberghs, G.
    Proceedings paper
    2002, Communications of the 3rd International Conference on Mathematical Methods in Reliability - MMR, 17/06/2002, p.31-34
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    Application of general finite mixture models to reliability data using likelihood estimation

    Andries, E.
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    Croes, K.
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    De Schepper, Luc
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    Molenberghs, G.
    Proceedings paper
    2003, 18th International Workshop on Statistical Modelling - IWSM, 7/07/2003, p.33-38
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    Cu interconnect lifetime estimation in the presence of thermal gradients

    Ding, Y.
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    Pedreira, O. Varela
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    Lofrano, M.
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    Zahedmanesh, H.
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    Ciofi, I.
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    Chavez, T.
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    Farr, H.
    Journal article
    2025-FEB 21, JOURNAL OF APPLIED PHYSICS, (137) 7
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    Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives

    Caers, J.F.J.M.
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    Zhao, X.J.
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    Lekens, Geert  
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    Dreesen, R.
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    Croes, K.
    ;
    Wong, E.H.
    Proceedings paper
    2003, Proceedings of the Business of Electronic Product Reliability and Reliability, 13/01/2003
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    Multi-step trap-assisted tunneling in Al-doped HfO2 used in advanced 2.5D metal-insulator-metal capacitors

    Fohn, C.
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    Chery, E.
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    Croes, K.
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    Stucchi, M.
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    Afanas'ev, V.
    Journal article
    2025-AUG 21, JOURNAL OF APPLIED PHYSICS, (138) 7
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    Statistical aspects of the degradation of LDD nMOSFETs

    Andries, E.
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    Dreesen, R.
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    Croes, K.
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    De Ceuninck, Ward  
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    De Schepper, Luc
    ;
    Groeseneken, Guido  
    Journal article
    2002, Microelectronics Reliability, (42) 9_11, p.1409-1413
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    The use of random effects in modeling non-linear hot-carrier degradation data

    Andries, E.
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    Croes, K.
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    Dreesen, R.
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    De Ceuninck, Ward  
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    De Schepper, Luc
    Proceedings paper
    2002, Communications of the 3rd International Conference on Mathematical Methods in Reliability - MMR, 17/06/2002, p.35-38
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    Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects

    Fang, Yu
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    Ciofi, I.
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    Roussel, Ph. J.
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    Lesniewska, A.
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    Carballo, V. M. Blanco
    ;
    Degraeve, R.
    ;
    Wolf, I. De
    Journal article
    2025-APR 7, IEEE TRANSACTIONS ON ELECTRON DEVICES

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