Browsing by Author "De Geest, Jan"
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Publication 100 Gb/s serial transmission over Copper using duo-binary signaling
Proceedings paper2016, Designcon, 19/01/2016, p.1-25Publication 56+ Gb/s serial transmission using duo-binary signaling
Proceedings paper2015, DesignCon, 27/01/2015, p.10TH-3Publication A generative modeling framework for statistical link analysis based on sparse data
; ; ; Journal article2018-01, IEEE Transactions on Components, Packaging and Manufacturing Technology, (8) 1, p.21-31Publication A novel generative stochastic model for high-speed interconnection links
Proceedings paper2017, Proceedings of DesignCon, 31/01/2017, p.1-23Publication A signal integrity design tool for system interconnects
Proceedings paper2000, Proceedings of the 4th European Symposium on Electromagnetic Compatibility, 11/09/2000, p.655-658Publication Adaptieve techniek voor de modellering van passieve planaire microgolfcircuits
De Geest, JanPHD thesis2000-06Publication Adaptive CAD-model building algorithm for general planar microwave structures
Journal article1999, IEEE Trans. Microwave Theory and Techniques, (47) 9, p.1801-1809Publication Adaptive sampling algorithm for accurate modeling of general interconnection structures
Proceedings paper1999, Proceedings of the 29th European Microwave Conference, 5/10/1999, p.178-181Publication Constrained EM-based modeling of passive components
Proceedings paper2002, IEEE MTT-S International Microwave Symposium Digest, 2/06/2002, p.2113-2116 (vol.3)Publication EM-based multidimensional parameterized modeling of general passive planar components
Proceedings paper2001, IEEE MTT-S International Microwave Symposium Digest, 20/05/2001, p.1745-48Publication Measurements of millimeter wave test structures for high speed chip testing
Proceedings paper2014, 18th IEEE Workshop on Signal and Power Integrity - SPI, 11/05/2014, p.1-4Publication Modeling differential via holes
Journal article2001, IEEE Trans. Advanced Packaging, (24) 3, p.357-363Publication Modelling complex via hole structures
Proceedings paper2001, Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP, 29/10/2001, p.149-152Publication Modelling differential via holes
Proceedings paper2000, Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP; 23-25 October 2000; Scotts, 23/10/2000, p.127-130Publication Recovering lossy multiconductor transmission line parameters from impedance or scattering representations
Proceedings paper2001, Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP, 29/10/2001, p.35-38