Browsing by Author "De Langhe, Pascal"
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Publication Design rules for an experimental setup using an open-ended coaxial probe based on theoretical modelling
Journal article1994, IEEE Trans. Instrumentation and Measurement, (43) 6, p.810-17Publication Hoogfrequent Karakterisatie van PCB- en Absorbermaterialen en van Connectorafschermingen
De Langhe, PascalPHD thesis1994-06Publication Mixed assembly of PCB using a novel flip-chip technology
Journal article2000, Advancing Microelectronics, (27) 5, p.28-30Publication Mixed assembly on PCB using a novel flip-chip technology
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.65-70Publication Mixed component integration in MCM-L technology
Proceedings paper1999, CARTS Europe - 13th European Passive Components Symposium, 18/10/1999, p.113-118Publication Near-field scanner for the accurate characterization of electromagnetic fields in the close vicinity of electronic devices and systems
Proceedings paper1996, Proceedings IEEE Instrumentation and Measurement Technology Conference, 4/06/1996, p.1119-1123Publication Photovia technology: some important aspects for reliability
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.240-245Publication Radiated emission of PCB tracks
Proceedings paper1996, EuPac '96.2nd European Conference on Electronic Packaging Technology and 8th International Conference on Interconnection Technol, p.140-142Publication Samenwerking Industrie-Universiteit Helpt de EMC-Materie te Ontmaskeren
Journal article1995, Het Ingenieursblad, 64, p.21-34Publication Standard SMT process for flip-chip assembly on FR4 substrate
Publication Theoretical analysis of an open-ended coaxial probe on a cylinder of finite thickness
Journal article1994, Microwave and Optical Technology Letters, (7) 6, p.274-279Publication Theoretical and experimental quantitative characterization of the near-fields of printed circuit board interconnection structures
Proceedings paper1995, Atlanta 1995.EMC - a Global Concern. IEEE 1995 International Symposium on Electromagnetic Compatibility. Symposium Record; Augus, p.471-474Publication Transfer Impedance Measurements on the Shielding of a Multi-Pins Board-to-Board Connector
Proceedings paper1994, 1994 IEEE International Symposium on Electromagnetic Compatibility, 22/08/1994, p.453-455