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Conference contributions
Mixed assembly on PCB using a novel flip-chip technology
Publication:
Mixed assembly on PCB using a novel flip-chip technology
Date
2000
Proceedings Paper
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4892.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
;
Stoukatch, Serguei
;
Vandecasteele, Bjorn
;
Van Calster, Andre
;
Criel, Steven
;
Willems, Geert
;
De Langhe, Pascal
;
Vandam, L.
;
Allaert, K.
Journal
Abstract
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2008
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
2008
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations