Publication:

Mixed assembly on PCB using a novel flip-chip technology

Date

2000
Proceedings Paper
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dc.contributor.authorVanfleteren, Jan
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVan Calster, Andre
dc.contributor.authorCriel, Steven
dc.contributor.authorWillems, Geert
dc.contributor.authorDe Langhe, Pascal
dc.contributor.authorVandam, L.
dc.contributor.authorAllaert, K.
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVan Calster, Andre
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-14T14:09:57Z
dc.date.available2021-10-14T14:09:57Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4888
dc.source.beginpage65
dc.source.conferenceIMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings
dc.source.conferencedate18/06/2000
dc.source.conferencelocationPrague Czech Republic
dc.source.endpage70
dc.title

Mixed assembly on PCB using a novel flip-chip technology

dc.typeProceedings paper
dspace.entity.typePublication
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