Browsing by Author "De Raedt, Walter"
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Publication 0-Level packaging techniques for flip-chip mounted MMICs
Proceedings paper2001, GAAS - European Gallium Arsenide and other Semiconductors Application Symposium, 24/09/2001, p.239-242Publication '1 Thru +2.5 Reflects': A new technique for de-embedding MIC/MMIC device measurements in fixed-length fixtures
Proceedings paper1996, Proceedings of the European Microwave Conference; September 1996; Prague, Czech Republic., p.174-177Publication 24GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors
Proceedings paper2005-09, Proceedings of the 31st European Solid-State Circuits Conference - ESSCIRC, 12/09/2005, p.89-92Publication 3-D antenna-in-packaging solution for microwave wireless sensor networks nodes
Journal article2011, IEEE Transactions on Antennas and Propagation, (59) 10, p.3617-3623Publication 3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring
Proceedings paper2011, International Conference on Solid State Devices and Materials - SSDM, 28/09/2011Publication 3D heterogeneous integration techniques for wireless devices
Oral presentation2010, RFIC Symposium Workshop M: RF Packaging Solutions for Wireless Communication PlatformsPublication 3D integration technology: status and application development
Proceedings paper2010, 40th European Solid-State Device Research Conference - ESSDERC, 13/09/2010, p.9-16Publication 3D Si-level integration in wireless sensor node
Publication 3D SoP integration of a BAN sensor node
Proceedings paper2005-06, Proceedings Electronic Components and Technology Conference - ECTC, 31/05/2005, p.1602-1616Publication 3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
Proceedings paper2011, 41st European Solid-State Device Research Conference - ESSDERC, 12/09/2011, p.127-130Publication 3D stacking heterogeneous integration for devices and modules
Proceedings paper2012, China Semiconductor Technology International Conference - CSTIC, 18/03/2012, p.721-726Publication 3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas
Proceedings paper2010, International Microwave Symposium - IMS, 23/05/2010, p.1028-1031Publication 3D TSV based high frequency components for RF IC and RF MEMS applications
Publication 45 degrees loaded-line phase shifter using switchable slow wave transmission lines
Proceedings paper2007, 69th ARFTG Microwave Measurement Conference, 8/06/2007Publication 45nm planar bulk CMOS 23GHz LNA with above IC inductors
Proceedings paper2010, IEEE International Conference on Circuits ans Systems - ISCAS, 30/05/2010, p.741-744Publication 50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS
Proceedings paper2009-02, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2009, p.382-384Publication 57-64 GHz seven-pole bandpass filter substrate integrated waveguide (SIW) in LTCC
Proceedings paper2011, IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, 15/09/2011, p.200-203