Browsing by Author "Dosseul, Franck"
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Publication Electromigration failure mechanisms for different flip chip configurations
Proceedings paper2011, IEEE International Reliability Physics Symposium - IRPS, 12/04/2011, p.592-596Publication Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Proceedings paper2011, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 17/04/2011Publication Outperformance of Cu pillar flip chip bumps in electromigration testing
; ; ; ; Proceedings paper2011, 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.312-316