Browsing by Author "Gabriel, Markus"
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Publication Process characterization of thin wafer debonding with thermoplastic materials
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012Publication W2W permanent stacking for 3D system integration
Proceedings paper2014, 16th IEEE Electronic Packaging Technology Conference - EPTC, 3/12/2014, p.1-4