Browsing by Author "Gardner, G."
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Publication Integration of low stress photopatternable silicones into a wafer level package
Proceedings paper2004-06, Proceedings of the 54th Electronic Components and Technology Conference - ECTC, 1/06/2004, p.170-174Publication Introducing a silicone under the bump configuration for stress relief in a wafer level package
Proceedings paper2003, Proceedings EPTC - Electronics Packaging Technology Conference, 11/12/2003, p.380-384