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Browsing by Author "Gelatos, J."

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    Cu resistivity scaling limits for 20 nm copper damascene lines

    Van Olmen, Jan  
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    List, Scott
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    Tokei, Zsolt  
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    Carbonell, Laure
    ;
    Brongersma, Sywert  
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    Volders, Henny  
    Proceedings paper
    2007, IEEE International Interconnect Technology Conference - IITC, 4/06/2007, p.49-51
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    Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology

    Veloso, Anabela  
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    Demuynck, Steven  
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    Ercken, Monique  
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    Goethals, Mieke
    ;
    Locorotondo, Sabrina  
    Proceedings paper
    2009-12, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.301-304
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    Full-field EUV and immersion lithography integration in 0.186μm² FinFET 6T-SRAM cell

    Veloso, Anabela  
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    Demuynck, Steven  
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    Ercken, Monique  
    ;
    Goethals, Mieke
    ;
    Demand, Marc  
    Proceedings paper
    2008, Technical Digest International Electron Devices Meeting - IEDM, 15/12/2008, p.861-864

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