Browsing by Author "Guidotti, E."

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High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, Gael
;
Dilliway, G.
;
Fischer, P.
;
Guidotti, E.
;
Luhn, Ole
;
Radisic, Alex
;
Zahraoui, S.
Journal article
2008, Microelectronic Engineering, (85) 10, p.1957-1961
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, Gael
;
Dilliway, Gabriela
;
Fischer, P.
;
Guidotti, E.
;
Bureau, C.
;
Palmans, Roger
Meeting abstract
2008, 17th Workshop Materials for Advanced Metallization, 2/03/2008, p.43-44