Publication:
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Date
Loading...
Journal
Abstract
Description
Statistics
Views
1993 since deposited on 2021-10-17
1last month
1last week
Acq. date: 2026-03-17
Citations
Statistics
Views
1993 since deposited on 2021-10-17
1last month
1last week
Acq. date: 2026-03-17
Citations