Publication:
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1989 since deposited on 2021-10-17
3last month
3last week
Acq. date: 2026-01-09
Citations
Metrics
Views
1989 since deposited on 2021-10-17
3last month
3last week
Acq. date: 2026-01-09
Citations