Browsing by Author "Haider, A."
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Publication Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications
Journal article2007, Microelectronic Engineering, (84) 11, p.2669-2674Publication Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Oral presentation2007, Advanced Metallization Conference: 17th Asian Session - ADMETA