Browsing by Author "Hiebert, Stephen"
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Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Journal article2019, IEEE Transactions on Semiconductor Manufacturing, (32) 1, p.54-61