Browsing by Author "Hsieh, Robert"
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Publication Large area interposer lithography
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.26-32Publication Microbump lithography for 3D stacking applications
Meeting abstract2013, 10th International Wafer-Level Packaging Conference - IWPLC, 4/11/2013Publication One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
Proceedings paper2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 4/12/2018, p.395-400Publication One micron redistribution for fan-out wafer level packaging
Proceedings paper2017, IEEE 19th Electronics Packaging Technology Conference - EPTC, 6/12/2017, p.1-7Publication Optimization of through Si via last microlithography for 3D packaging
Proceedings paper2015, 13th International Wafer-Level Packaging Workshop - IWLPC, 13/10/2015Publication Overlay performance of through Si via last lithography for 3d packaging
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.564-568Publication Process characterization for donut TSV's
Meeting abstract2014, International Wafer-Level Packaging Conference - IWLPC, 11/11/2014