Browsing by Author "Hsu, Yung-Yu"
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Publication A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
Proceedings paper2009, Materials and Devices for Flexible and Stretchable Electronics, 13/04/2009, p.1192-PP15-03Publication Delamination of metal-polymer interfaces in microelectronics
Proceedings paper2010, IV European Conference on Computational Mechanics - ECCM IV, 16/05/2010Publication Design and analysis of a novel fine pitch and highly stretchable interconnect
Journal article2010, Microelectronics International, (27) 1, p.33-38Publication Design and implementation of flexible and stretchable systems
Journal article2011, Microelectronics Reliability, (51) 6, p.1069-1076Publication Design and performance of metal conductors for stretchable electronic circuits
Journal article2009, Circuit World, (35) 1, p.22-29Publication Design and performance of metal conductors for stretchable electronic circuits
Proceedings paper2008, 2nd Electronics Systemintegration Technology Conference - STC, 1/09/2008, p.371-376Publication Design optimization and analysis of a novel nanocomposite-film typed flip chip technology
;Cheng, Hsien-Chie ;Hsieh, Kun-Yu ;Hsu, Yung-YuUang, Ruoh-HueyProceedings paper2009, 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - IMPACT, 21/10/2009Publication Fatigue lifetime of stretchable interconnects
Oral presentation2011, 3rd Flexible and Stretchable Electronics WorkshopPublication Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Proceedings paper2011-04, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 18/04/2011Publication In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect
Journal article2009, Journal of Materials Research, (24) 12, p.3573-3582Publication Numerical and experimental analysis of stretching induced interconnect delamination
Oral presentation2009, Flexable & Stretchable Electronics WorkshopPublication Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits
Meeting abstract2010, 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale, 30/08/2010Publication On the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology
;Cheng, Hsien-Chie ;Chen, Wen-Hwa ;Lin, Chieh-Sheng ;Hsu, Yung-YuUang, Ruoh-HueyJournal article2009, IEEE Transactions on Advanced Packaging, (32) 2, p.546-563Publication Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization
Journal article2011, IEEE Transactions on Electron Devices, (58) 8, p.2680-2688Publication Printed circuit board technology inspired stretchable circuits
Journal article2012, MRS Bulletin, (37) 3, p.254-260Publication Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies
Book chapter2013Publication Reliability assessment of stretchable interconnect
Meeting abstract2010, IEEE International Microsystems, Packaging, Assembly, and Circuits Technology Conference - IMPACT, 20/10/2010Publication Reliability assessment of stretchable interconnects
Proceedings paper2010, IEEE International Microsystems, Packaging, Assembly and Circuit Technology conference - IMPACT, 20/10/2010