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Browsing by Author "Hsu, Yung-Yu"

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    A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Proceedings paper
    2009, Materials and Devices for Flexible and Stretchable Electronics, 13/04/2009, p.1192-PP15-03
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    Delamination of metal-polymer interfaces in microelectronics

    van der Sluis, Olaf
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    Hsu, Yung-Yu
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    Noijen, Sander
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    Timmermans, Peter
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    Gonzalez, Mario  
    Proceedings paper
    2010, IV European Conference on Computational Mechanics - ECCM IV, 16/05/2010
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    Design and analysis of a novel fine pitch and highly stretchable interconnect

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Journal article
    2010, Microelectronics International, (27) 1, p.33-38
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    Design and implementation of flexible and stretchable systems

    Gonzalez, Mario  
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    Vandevelde, Bart  
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    Christiaens, Wim
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    Hsu, Yung-Yu
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    Iker, Francois
    Journal article
    2011, Microelectronics Reliability, (51) 6, p.1069-1076
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    Design and performance of metal conductors for stretchable electronic circuits

    Gonzalez, Mario  
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    Axisa, Fabrice
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    Bossuyt, Frederick  
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    Hsu, Yung-Yu
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    Vandevelde, Bart  
    Journal article
    2009, Circuit World, (35) 1, p.22-29
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    Design and performance of metal conductors for stretchable electronic circuits

    Gonzalez, Mario  
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    Axisa, Fabrice
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    Bossuyt, Frederick  
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    Hsu, Yung-Yu
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    Vandevelde, Bart  
    Proceedings paper
    2008, 2nd Electronics Systemintegration Technology Conference - STC, 1/09/2008, p.371-376
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    Design for reliability of stretchable electronics

    Hsu, Yung-Yu
    PHD thesis
    2011-07
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    Design optimization and analysis of a novel nanocomposite-film typed flip chip technology

    Cheng, Hsien-Chie
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    Hsieh, Kun-Yu
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    Hsu, Yung-Yu
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    Uang, Ruoh-Huey
    Proceedings paper
    2009, 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - IMPACT, 21/10/2009
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    Fatigue lifetime of stretchable interconnects

    Gonzalez, Mario  
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    Hsu, Yung-Yu
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
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    De Wolf, Ingrid  
    Oral presentation
    2011, 3rd Flexible and Stretchable Electronics Workshop
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    Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM

    Ivankovic, Andrej
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    Vanstreels, Kris  
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    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Brizar, Guy
    Proceedings paper
    2011-04, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 18/04/2011
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    In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Journal article
    2009, Journal of Materials Research, (24) 12, p.3573-3582
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    Modeling of printed circuit board inspired stretchable electronic systems

    Gonzalez, Mario  
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    Hsu, Yung-Yu
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    Vanfleteren, Jan  
    Book chapter
    2013
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    Numerical and experimental analysis of stretching induced interconnect delamination

    van der Sluis, Olaf
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    Hsu, Yung-Yu
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    Timmermans, P.H.M.
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    Gonzalez, Mario  
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    Hoefnagels, J.P.M.
    Oral presentation
    2009, Flexable & Stretchable Electronics Workshop
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    Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits

    van der Sluis, Olaf
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    Hsu, Yung-Yu
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    Timmermans, P.H.M.
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    Gonzalez, Mario  
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    Hoefnagels, J.P.M.
    Meeting abstract
    2010, 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale, 30/08/2010
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    On the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology

    Cheng, Hsien-Chie
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    Chen, Wen-Hwa
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    Lin, Chieh-Sheng
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    Hsu, Yung-Yu
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    Uang, Ruoh-Huey
    Journal article
    2009, IEEE Transactions on Advanced Packaging, (32) 2, p.546-563
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    Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
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    De Wolf, Ingrid  
    Journal article
    2011, IEEE Transactions on Electron Devices, (58) 8, p.2680-2688
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    Printed circuit board technology inspired stretchable circuits

    Vanfleteren, Jan  
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Hsu, Yung-Yu
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    Vervust, Thomas  
    Journal article
    2012, MRS Bulletin, (37) 3, p.254-260
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    Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies

    Vanfleteren, Jan  
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    Bossuyt, Frederick  
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    Loher, Thomas
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    Hsu, Yung-Yu
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    Gonzalez, Mario  
    Book chapter
    2013
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    Reliability assessment of stretchable interconnect

    Hsu, Yung-Yu
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    Dimcic, Biljana
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
    Meeting abstract
    2010, IEEE International Microsystems, Packaging, Assembly, and Circuits Technology Conference - IMPACT, 20/10/2010
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    Reliability assessment of stretchable interconnects

    Hsu, Yung-Yu
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    Dimcic, Biljana
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    Gonzalez, Mario  
    ;
    Bossuyt, Frederick  
    ;
    Vanfleteren, Jan  
    Proceedings paper
    2010, IEEE International Microsystems, Packaging, Assembly and Circuit Technology conference - IMPACT, 20/10/2010
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