Browsing by Author "Iker, Francois"
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Publication 3D Embedding and interconnection of ultra thin (<20um) silicon dies
Proceedings paper2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.222-226Publication 3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Proceedings paper2009, Materials and Technologies for 3-D Integration, 1/12/2008, p.1112-E01-05Publication A descum review for cleaning surfaces in polymer embedded process flows
Meeting abstract2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/09/2010, p.54-55Publication Alternative patterning techniques enabling fine pitch interconnection on topography surfaces
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.431-434Publication Chip ultra-thinning and embedding technology for autonomous sensors array applications
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 25/05/2009, p.1437-1439Publication Design and implementation of flexible and stretchable systems
Journal article2011, Microelectronics Reliability, (51) 6, p.1069-1076Publication Design and integration technology for miniature medical microsystems
Proceedings paper2008, Technical Digest International Electron Devices Meeting - IEDM, 15/12/2008, p.319-322Publication Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 26/05/2009, p.1284-1288Publication Diamond bit cutting for processing high topography wafers
Proceedings paper2009, 11th Electronics Packaging Technology Conference - EPTC, 9/12/1990Publication High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Proceedings paper2008, SEMICON Europe: Advanced Packaging Conference, 7/10/2008Publication Medical electronic system miniaturization using ultra thin chip embedding and stacking technology
Oral presentation2007, 2nd Medical Electronics Symposium - MEPTECPublication One-mask CMOS compatible process for the fabrication of three-dimensional self-assembled thin-film SOI microelectromechanical systems
Publication Process technology for the fabrication of a chip-in-wire style packaging
Proceedings paper2008-05, 58th Electronic Components abd Technology Conference - ECTC, 27/05/2008, p.303-308Publication Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques
Proceedings paper2008, 13th Meeting of the Symposium on Polymers for Microelectronics, 7/05/2008Publication Technology platform for 3-D stacking of thinned embedded dies
Proceedings paper2008, 58th Electronic Components abd Technology Conference - ECTC, 27/05/2008, p.8-11Publication Thermo-mechanical analysis of flexible and stretchable systems
Proceedings paper2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 25/04/2010, p.175-181Publication Ultra thin chip embedding technology (UTCS-UTCP)
; ; ; Iker, FrancoisOral presentation2010, Embedded Wafer level Packaging Workshop, IMAPS-FrancePublication Ultra thin die embedding technology with 20um-pitch interconnection
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.1575-1580