Browsing by Author "Kim, Jinwoo"
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Publication Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
Proceedings paper2021, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), JUL 26-28, 2021Publication Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs
Journal article2023, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, (13) 3, p.300-314