Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

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Accepted version 15.52 MB

Published version 3.32 MB

Author(s)

Agnesina, Anthony

;

Brunion, Moritz

;

;

Garcia-Ortiz, Alberto

;

Milojevic, Dragomir

;

Catthoor, Francky

;

Mirabelli, Gioele

;

;

Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Metrics

847 since deposited on 2023-06-24

Acq. date: 2025-10-27

1136 since deposited on 2023-06-24

Acq. date: 2025-10-27