Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Agnesina, Anthony; Brunion, Moritz; Kim, Jinwoo; Garcia-Ortiz, Alberto; Milojevic, Dragomir; Catthoor, Francky; Mirabelli, Gioele; Komalan, Manu; Lim, Sung Kyu

doi:10.1109/TCPMT.2023.3264520

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Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Date

2023

Journal article

https://doi.org/10.1109/TCPMT.2023.3264520

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Author(s)

Agnesina, Anthony

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Brunion, Moritz

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Kim, Jinwoo

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Garcia-Ortiz, Alberto

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Journal

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

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1139 since deposited on 2023-06-24

Acq. date: 2026-05-17

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

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