Publication:

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Date

2023
Journal article
https://doi.org/10.1109/TCPMT.2023.3264520
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dc.contributor.authorAgnesina, Anthony
dc.contributor.authorBrunion, Moritz
dc.contributor.authorKim, Jinwoo
dc.contributor.authorGarcia-Ortiz, Alberto
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorCatthoor, Francky
dc.contributor.authorMirabelli, Gioele
dc.contributor.authorKomalan, Manu
dc.contributor.authorLim, Sung Kyu
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorMirabelli, Gioele
dc.contributor.imecauthorKomalan, Manu
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecMirabelli, Gioele::0000-0001-7060-4836
dc.date.accessioned2023-08-03T10:16:00Z
dc.date.available2023-06-24T19:58:57Z
dc.date.available2023-06-26T12:27:04Z
dc.date.available2023-08-03T10:16:00Z
dc.date.embargo2023-03-31
dc.date.issued2023
dc.identifier.doi10.1109/TCPMT.2023.3264520
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42084
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage300
dc.source.endpage314
dc.source.issue3
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages15
dc.source.volume13
dc.subject.keywordsCIRCUITS
dc.subject.keywordsFace-to-Face-Bonded 3-D ICs
dc.subject.keywordsPower, Performance, Area, and Cost Analysis
dc.title

Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

dc.typeJournal article
dspace.entity.typePublication
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