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Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
Publication:
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs
Date
2021
Proceedings Paper
https://doi.org/10.1109/ISLPED52811.2021.9502475
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islped21anthony.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Agnesina, Anthony
;
Brunion, Moritz
;
Kim, Jinwoo
;
Garcia-Ortiz, Alberto
;
Milojevic, Dragomir
;
Catthoor, Francky
;
Perumkunnil, Manu
;
Lim, Sung Kyu
Journal
na
Abstract
Description
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99
since deposited on 2021-11-02
Acq. date: 2025-10-27
Views
1781
since deposited on 2021-11-02
Acq. date: 2025-10-27
Citations
Metrics
Downloads
99
since deposited on 2021-11-02
Acq. date: 2025-10-27
Views
1781
since deposited on 2021-11-02
Acq. date: 2025-10-27
Citations