Browsing by Author "Kolics, Artur"
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Publication Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.25-28Publication Electromigration and thermal storage study of barrierless Co vias
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.48-50Publication Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
Meeting abstract2012, Advanced Metallization Conference, 9/10/2012