Publication:
Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
Date
Loading...
Journal
Abstract
Description
Statistics
Views
1937 since deposited on 2021-10-20
Acq. date: 2026-04-06
Citations
Statistics
Views
1937 since deposited on 2021-10-20
Acq. date: 2026-04-06
Citations