Publication:

Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed

Date

2012
Meeting abstract
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Author(s)

Siew, Yong Kong  
;
Swerts, Johan  
;
Dictus, Dries  
;
El-Mekki, Zaid  
;
Armini, Silvia  
;
Dordi, Yezdi
;
Yoon, Alex
;
Kolics, Artur
;
Barbarin, Yohan
;
Croes, Kristof  
;
Boemmels, Juergen  
;
Tokei, Zsolt  

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Abstract

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