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Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
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1930 since deposited on 2021-10-20
1last month
Acq. date: 2025-12-10
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Metrics
Views
1930 since deposited on 2021-10-20
1last month
Acq. date: 2025-12-10
Citations