Publication:
Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed
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1934 since deposited on 2021-10-20
4last month
Acq. date: 2026-01-25
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Statistics
Views
1934 since deposited on 2021-10-20
4last month
Acq. date: 2026-01-25
Citations