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Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed

Date

2012
Meeting abstract
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dc.contributor.authorSiew, Yong Kong
dc.contributor.authorSwerts, Johan
dc.contributor.authorDictus, Dries
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorArmini, Silvia
dc.contributor.authorDordi, Yezdi
dc.contributor.authorYoon, Alex
dc.contributor.authorKolics, Artur
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-20T16:07:14Z
dc.date.available2021-10-20T16:07:14Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21508
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate9/10/2012
dc.source.conferencelocationAlbany, NY USA
dc.title

Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seed

dc.typeMeeting abstract
dspace.entity.typePublication
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