Browsing by Author "Krishnan, Sitaraman"

Effect of deposition methods on material removal rate during nickel CMP

Fundamental investigation of chemical mechanical polishing of GaAs in ailica dispersions: Material removal and arsenic trihydride formation pathways

Inspection, characterization and classification of defects for improved CMP of III-V materials

Use of multifunctional carboxylic acids and hydrogen peroxide to improve surface quality and minimize phosphine evolution during chemical mechanical polishing of indium phosphide surfaces