Browsing by Author "Lauwaert, Ralph"
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Publication Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Proceedings paper2018, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-6Publication Effect of a ductile, low melting point alloy on the hot tear defect on lead-free ball grid arrays
Proceedings paper2020, SMTA International, 28/09/2020, p.#454Publication ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Proceedings paper2021, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), OCT 26-28, 2021Publication Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Proceedings paper2016-04, 17th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectr. and Microsyst. - EuroSimE, 17/04/2016Publication Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Journal article2017, Microelectronics Reliability, 74, p.131-135Publication How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Proceedings paper2016-04, International Conference on Electronics Packaging - ICEP, 20/04/2016, p.94-98Publication Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Proceedings paper2013, European Microelectronics and Packaging Conference - EMPC, 9/09/2013Publication Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Proceedings paper2019, 20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 24/03/2019, p.1-5Publication Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques
Proceedings paper2020, EuWoRel Workshop, 21/10/2020Publication Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Proceedings paper2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023