Browsing by Author "Li, H."
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Publication Analog radio-over-fiber transceivers based on III-V-on-silicon photonics
Journal article2018-11, IEEE Photonics Technology Letters, (30) 21, p.1818-1821Publication Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry
; ; ; Froyen, L.Journal article1999, J. Electrochem. Soc., (146) 10, p.3843-3851Publication Characterisation of tungsten nitride barrier layer for copper metallisation
Proceedings paper1999, Microscopy of Semiconducting Materials, 22/03/1999, p.541-544Publication Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
Oral presentation1998, Advanced Metallization Conference; October 1998;Publication Characterization of ultra thin layers by Rutherford backscattering spectrometry
Proceedings paper1999, Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes, 16/09/1999, p.160-169Publication Chemical and electrical characterization of the interaction of BCl 3/Cl2 etching and CF4/H2O stripping plasmas with aluminum surfaces
Journal article1999, J. Electrochem. Soc., 11, p.4230-4235Publication Distinct expression and methylation patterns for genes with different fates following a single whole-genome duplication in flowering plant
Publication Effect of Cu on Al interfacial mass transport in bamboo rie and damscene (AlCu)
Proceedings paper1999, Materials Reliability in Microelectronics IX; 5-9 April 1999; San Francisco, Ca, USA., p.91-96Publication Evaluation of post metal etch cleaning by analyzing chemical compositions and distributions
; ; ; Froyen, L.Oral presentation1998, 4th International Symposium on Ultra Clean Processing of Silicon Surfaces - UCPSSPublication Evaluation of post metal etch cleaning by analyzing chemical compositions and distributions
; ; ; Froyen, L.Proceedings paper1999, Ultra Clean Processing of Silicon Surfaces; Proceedings of the 4th International Symposium on Ultra Clean Processing of Silicon, 21/09/1998, p.177-180Publication Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Publication Thermal desorption issues related to silicidation and back-end metallization
; ; ; ; Froyen, L.Oral presentation1999, Advanced Metallization Conference; 28-30 September 1999; Orlando, FL, USA.