Browsing by Author "Li, Shifang"
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Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication In-device high resolution and high throughput optical metrology for process development and monitoring
Proceedings paper2020, 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), AUG 24-26, 2020Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Journal article2019, IEEE Transactions on Semiconductor Manufacturing, (32) 1, p.54-61Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Proceedings paper2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017, p.331-336