Browsing by Author "Liu, C.S."
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Publication 3D stacking using Cu-Cu direct bonding
Proceedings paper2012-02, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.1-MarPublication 3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
; ; ; ; Publication Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.572-575Publication Self aligned CuGeN process for 32/22nm nodes and beyond
Proceedings paper2008, 11th IEEE International Interconnect Technology Conference - IITC, 1/06/2008, p.199-201