Browsing by Author "Liu, Xiao"
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Publication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Carrier Systems for Collective Die-to-Wafer Bonding
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.2058-2063Publication Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.296-302