Browsing by Author "Ma, Paul"
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Publication CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
Meeting abstract2013, 224th ECS Fall Meeting, 27/10/2013, p.2081Publication Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations
Proceedings paper2009, Proceedings of the IEEE International Interconnect Technology Conference, 1/06/2009, p.200-202