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Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations
Publication:
Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations
Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carbonell, Laure
;
Volders, Henny
;
Heylen, Nancy
;
Kellens, Kristof
;
Caluwaerts, Rudy
;
Devriendt, Katia
;
Altamirano Sanchez, Efrain
;
Wouters, Johan M. D.
;
Gravey, Virginie
;
Shah, Kavita
;
Luo, Qian
;
Sundarrajan, Arvind
;
Lu, Jiang
;
Aubuchon, Joseph
;
Ma, Paul
;
Narasimhan, Murali
;
Cockburn, Andrew
;
Tokei, Zsolt
;
Beyer, Gerald
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1928
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
Metrics
Views
1928
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations