Publication:

Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations

Date

2009
Proceedings Paper
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dc.contributor.authorCarbonell, Laure
dc.contributor.authorVolders, Henny
dc.contributor.authorHeylen, Nancy
dc.contributor.authorKellens, Kristof
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorDevriendt, Katia
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorWouters, Johan M. D.
dc.contributor.authorGravey, Virginie
dc.contributor.authorShah, Kavita
dc.contributor.authorLuo, Qian
dc.contributor.authorSundarrajan, Arvind
dc.contributor.authorLu, Jiang
dc.contributor.authorAubuchon, Joseph
dc.contributor.authorMa, Paul
dc.contributor.authorNarasimhan, Murali
dc.contributor.authorCockburn, Andrew
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorWouters, Johan M. D.
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.date.accessioned2021-10-17T21:30:47Z
dc.date.available2021-10-17T21:30:47Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15063
dc.source.beginpage200
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference
dc.source.conferencedate1/06/2009
dc.source.conferencelocationSapporo Japan
dc.source.endpage202
dc.title

Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations

dc.typeProceedings paper
dspace.entity.typePublication
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