Browsing by Author "Matsushita, K"

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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef
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Tsutsue, M.
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Ikeda, Atsushi
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Verdonck, Patrick
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Tokei, Zsolt
Oral presentation
2007, Advanced Metallization Conference: 17th Asian Session
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

De Roest, David
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Vereecke, Bart
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Huffman, Craig
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Heylen, Nancy
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Croes, Kristof
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Arai, H
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Takamure, N
Meeting abstract
2009, Advanced Metallization Conference, 13/10/2009
Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route

De Roest, David
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Travaly, Youssef
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Beynet, J.
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Sprey, Hessel
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Labat, J.
;
Huffman, Craig
Journal article
2010, Microelectronic Engineering, (87) 3, p.311-315