Browsing by Author "Matsushita, K."
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Publication Improved low-k dielectric properties using He/H2 plasma for resist removal
Meeting abstract2008, Advanced Metallization Conference - AMC, 23/09/2008Publication Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
Oral presentation2009, ADMETA 2009Publication Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Proceedings paper2008, 11th IEEE International Interconnect Technology Conference - IITC, 1/06/2008, p.52-54Publication Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
Meeting abstract2009, 18th Workshop Materials for Advanced Metallization - MAM, 8/03/2009