Browsing by Author "Miyamori, Yuichi"
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Publication Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Proceedings paper2014, Advanced Metallization Conference - ADMETA: 24th Asian Session, 22/10/2014Publication Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Journal article2015, Japanese Journal of Applied Physics, (54) 5S, p.05EE01Publication On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing
Journal article2013, Microelectronic Engineering, 106, p.155-159Publication Thermal stability of copper through-silicon via barriers during IC processing
Proceedings paper2011, IEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM, 8/05/2012, p.P2.51