Publication:

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Date

2014

Proceedings Paper

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Author(s)

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De Messemaeker, Joke

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Tyrovouzi, Anna Maria

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Miyamori, Yuichi

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De Wolf, Ingrid

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Metrics

1928 since deposited on 2021-10-22

Acq. date: 2025-12-13