Publication:

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Date

2014
Proceedings Paper
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dc.contributor.authorOba, Yoshiyuki
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorTyrovouzi, Anna Maria
dc.contributor.authorMiyamori, Yuichi
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorWang, Teng
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-22T04:22:23Z
dc.date.available2021-10-22T04:22:23Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24332
dc.source.conferenceAdvanced Metallization Conference - ADMETA: 24th Asian Session
dc.source.conferencedate22/10/2014
dc.source.conferencelocationTokyo Japan
dc.title

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

dc.typeProceedings paper
dspace.entity.typePublication
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