Browsing by Author "Morlion, D."
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Publication A procedure for accurate high-frequency characterisation of multi-pins backplane connectors
Proceedings paper1995, Proceedings IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging; 2-4 Oct. 1995; Portland, OR, USA., p.70-72Publication A signal integrity design tool for system interconnects
Proceedings paper2000, Proceedings of the 4th European Symposium on Electromagnetic Compatibility, 11/09/2000, p.655-658Publication High precision LIGA structures for optical fibre-in-board technology
Publication Modeling differential via holes
Journal article2001, IEEE Trans. Advanced Packaging, (24) 3, p.357-363Publication Modelling complex via hole structures
Proceedings paper2001, Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP, 29/10/2001, p.149-152Publication Modelling complex via hole structures
Journal article2002, IEEE Trans. Advanced Packaging, (25) 2, p.206-214Publication Modelling differential via holes
Proceedings paper2000, Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP; 23-25 October 2000; Scotts, 23/10/2000, p.127-130Publication Optical interconnect solutions to the I/O-problem in future CMOS generations
Proceedings paper1997, OSA Topical Meeting on Optics in Computing, 18/03/1997, p.275-285Publication Optical interconnection using 'fibre in board' technology
Publication Transfer Impedance Measurements on the Shielding of a Multi-Pins Board-to-Board Connector
Proceedings paper1994, 1994 IEEE International Symposium on Electromagnetic Compatibility, 22/08/1994, p.453-455