Browsing by Author "Nelis, Marc"
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Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Design, verification and simulation of 3D circuit
Oral presentation2009, Design, Automation and Test in Europe Conference - DATE: Workshop on 3D Integration (W5)Publication Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
Proceedings paper2010-09, IEEE Custom Integrated Circuits Conference - CICC, 19/09/2010, p.1-4