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Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
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Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
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Date
2010-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van der Plas, Geert
;
Thijs, Steven
;
Linten, Dimitri
;
Katti, Guruprasad
;
Limaye, Paresh
;
Mercha, Abdelkarim
;
Stucchi, Michele
;
Oprins, Herman
;
Vandevelde, Bart
;
Minas, Nikolaos
;
Cupak, Miroslav
;
Dehan, Morin
;
Nelis, Marc
;
Agarwal, Rahul
;
Dehaene, Wim
;
Travaly, Youssef
;
Beyne, Eric
;
Marchal, Pol
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1959
since deposited on 2021-10-18
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Acq. date: 2025-12-10
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Views
1959
since deposited on 2021-10-18
1
last month
Acq. date: 2025-12-10
Citations