Publication:

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

Date

2010-09
Proceedings Paper
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dc.contributor.authorVan der Plas, Geert
dc.contributor.authorThijs, Steven
dc.contributor.authorLinten, Dimitri
dc.contributor.authorKatti, Guruprasad
dc.contributor.authorLimaye, Paresh
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorStucchi, Michele
dc.contributor.authorOprins, Herman
dc.contributor.authorVandevelde, Bart
dc.contributor.authorMinas, Nikolaos
dc.contributor.authorCupak, Miroslav
dc.contributor.authorDehan, Morin
dc.contributor.authorNelis, Marc
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorDehaene, Wim
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorMarchal, Pol
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorThijs, Steven
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecThijs, Steven::0000-0003-2889-8345
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T22:58:14Z
dc.date.available2021-10-18T22:58:14Z
dc.date.embargo9999-12-31
dc.date.issued2010-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18168
dc.source.beginpage1
dc.source.conferenceIEEE Custom Integrated Circuits Conference - CICC
dc.source.conferencedate19/09/2010
dc.source.conferencelocationSan Jose, CA US
dc.source.endpage4
dc.title

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

dc.typeProceedings paper
dspace.entity.typePublication
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