Browsing by Author "Patz, Matthias"
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Publication Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects
Journal article2004, Microelectronic Engineering, (76) 1_4, p.70-75Publication Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
Oral presentation2003, Advanced Metallization ConferencePublication Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.549-553